Impact of Packaging Design on Reliability of Large Die Cu/Low-$\kappa$ (BD) Interconnect-Reference-Cited by-同舟云学术

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Impact of Packaging Design on Reliability of Large Die Cu/Low-$\kappa$ (BD) Interconnect

Published:2012-05 Issue:5 Volume:2 Page:807-816
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Chai Tai Chong,Zhang Xiaowu,Li Hong Yu,Sekhar Vasarla Nagendra,Khan Oratti Kalandar Navas,Lau John,Murthy Ramana,Tan Yeow Meng,Cheng Chek Kweng,Liew Siao Li,Chi Dongzhi

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/5503870/6194283/06177653.pdf?arnumber=6177653

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging;Journal of Electronic Packaging;2023-06-23

2. Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV Interposers;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-01

3. State of the Art of Lead-Free Solder Joint Reliability;Journal of Electronic Packaging;2020-09-03

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