Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz-Reference-Cited by-同舟云学术

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Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz

Published:2012-03 Issue:3 Volume:2 Page:402-409
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Hsu Li-Han,Oh Chee-Way,Wu Wei-Cheng,Chang Edward Yi,Zirath Herbert,Wang Chin-Te,Tsai Szu-Ping,Lim Wee-Chin,Lin Yueh-Chin

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/5503870/6163201/06143996.pdf?arnumber=6143996

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. A Cost-Effective Solution for Testing High-Performance Integrated Circuits;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-04

3. Carbon Nanotubes as Microbumps for 3D Integration;Carbon Nanotubes for Interconnects;2016-07-10

4. Carbon Nanostructures Dedicated to Millimeter-Wave to THz Interconnects;IEEE Transactions on Terahertz Science and Technology;2015-05

5. Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications;IEEE Microwave and Wireless Components Letters;2014-01

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