Carbon Nanotubes as Microbumps for 3D Integration
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Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-319-29746-0_8
Reference45 articles.
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3. Saraswat P (2002) http://www.stanford.edu/class/ee311/NOTES/Interconnect Scaling.pdf
4. Hong L, Chuan X, Srivastava N, Banerjee K (2009) Carbon nanomaterials for next-generation interconnects and passives: physics, status, and prospects. IEEE Trans Electron Devices 56:1799–1821
5. Awano Y, Sato S, Nihei M, Sakai T, Ohno Y, Mizutani T (2010) Carbon nanotubes for VLSI: interconnect and transistor applications. Proc IEEE 98:2015–2031
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