Lifetime Prediction of Non-Collapsible Solder Joints in LTCC/PWB Assemblies Using a Recalibrated Engelmaier's Model-Reference-Cited by-同舟云学术

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Lifetime Prediction of Non-Collapsible Solder Joints in LTCC/PWB Assemblies Using a Recalibrated Engelmaier's Model

Published:2012-06 Issue:6 Volume:2 Page:994-1001
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Putaala Jussi,Salmela Olli,Nousiainen Olli,Kangasvieri Tero,Uusimaki Antti

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/5503870/6205691/06133330.pdf?arnumber=6133330

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design and optimization of lead-forming for CFP package based on finite element analysis;2022 10th International Symposium on Next-Generation Electronics (ISNE);2023-05-12

2. Reliability modeling of mixtures of one-shot units under thermal cyclic stresses;Reliability Engineering & System Safety;2017-11

3. BGA Interconnection Reliability in Mirrored Module Configurations;IEEE Transactions on Components, Packaging and Manufacturing Technology;2017-10

4. Lifetime prediction and design aspects of reliable lead-free non-collapsible BGA joints in LTCC packages for RF/microwave telecommunication applications;Soldering & Surface Mount Technology;2014-05-27

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