Author:
Cheng Yao,Elsayed Elsayed A.
Subject
Industrial and Manufacturing Engineering,Safety, Risk, Reliability and Quality
Reference35 articles.
1. Reliability of lead-free solder interconnections in thermal and power cycling tests;Li;IEEE Trans Compon Packag Technol,2009
2. Reliability physics and engineering;McPherson,2010
3. Fatigue reliability analysis of Sn–Ag–Cu solder joints subject to thermal cycling;Che;IEEE Trans Device Mater Reliab,2013
4. Reliability analysis of some ceramic lead-free solder attachments;Salmela;SMTA J Surf Mount Technol,2005
5. How to estimate solder joint reliability, part 1;Engelmaier;Global SMT Packag,2007
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