Funder
Semiconductor Research Corporation
Air Force Research Laboratory
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
18 articles.
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1. AutoFlex;Proceedings of the 28th Asia and South Pacific Design Automation Conference;2023-01-16
2. Mechanical Characterization of Ultra-Thin, Flexible Glass Substrates for RF Applications;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-09
3. Impact of Torsion on Flexible Interconnects;2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS);2022-07-10
4. An automatic numerical approach to optimize flexible serpentine structure design;Flexible and Printed Electronics;2022-05-24
5. Mechanical and Ka-Band Electrical Reliability Testing of Interconnects in 5G Wearable System-on-Package Designs Under Bending;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05