Mechanical Characterization of Ultra-Thin, Flexible Glass Substrates for RF Applications-Reference-Cited by-同舟云学术

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Mechanical Characterization of Ultra-Thin, Flexible Glass Substrates for RF Applications

Published:2022-09 Issue:9 Volume:12 Page:1465-1473
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Sivapurapu Sridhar¹^ORCID,Chen Rui²^ORCID,Kanno Kimiyuki³,Kakutani Takenori⁴,Letz Martin⁵,Liu Fuhan¹,Sitaraman Suresh K.²^ORCID,Swaminathan Madhavan¹

Affiliation:

1. School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA

2. Woodruff School of Mechanical Engineering, Georgia Institute of Technology Atlanta, Atlanta, GA, USA

3. JSR Corporation, Yokkaichi, Japan

4. Taiyo Ink Mfg. Company Ltd., Saitama, Japan

5. SCHOTT AG, Mainz, Germany

Funder

Industry Consortium at the Georgia Tech Packaging Research Center

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/9913798/09851681.pdf?arnumber=9851681

Reference21 articles.

1. Multi-Physics Modeling and Characterization of Components on Flexible Substrates

2. Advanced Low-Loss and High-Density Photosensitive Dielectric Material for RF/Millimeter-Wave Applications

3. Fabrication and Reliability Demonstration of 3 µm Diameter Photo Vias at 15 µm Pitch in Thin Photosensitive Dielectric Dry Film for 2.5 D Glass Interposer Applications

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. D-Band Corrugated Horn Antenna Using Multilayer Structured-Glass Technology;IEEE Antennas and Wireless Propagation Letters;2024-09

2. Machine-Learning Guided Strain-Relief Patterns for Maximizing Stretchability of Printed Conductors;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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