Design and Thermal Analysis of a 3-D Printed Impingement Pin Fin Cold Plate for Heterogeneous Integration Application-Reference-Cited by-同舟云学术

Design and Thermal Analysis of a 3-D Printed Impingement Pin Fin Cold Plate for Heterogeneous Integration Application

Published:2022-07 Issue:7 Volume:12 Page:1091-1099
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Hoang Cong Hiep¹^ORCID,Azizi Arad¹,Fallahtafti Najmeh¹,Rangarajan Srikanth¹^ORCID,Radmard Vahideh¹^ORCID,Arvin Charles²,Sikka Kamal²,Schiffres Scott¹,Sammakia Bahgat¹

Affiliation:

1. Department of Mechanical Engineering, State University of New York at Binghamton, Binghamton, NY, USA

2. IBM Corporation, Armonk, NY, USA

Funder

Semiconductor Research Corporation (SRC) through the Center for Heterogeneous Integration Research on Packaging

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/9841047/09804761.pdf?arnumber=9804761

Reference35 articles.

1. A study of direct liquid cooling for high-density chips and accelerators

2. Test results from the comparison of three liquid cooling methods for high-power processors

3. Direct liquid cooling of bare die packages using a microchannel cold plate

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5. Two-Phase Flow Control of Electronics Cooling With Pseudo-CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental Evaluation

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