High-Frequency Behavior Analysis and Modeling of Degraded Conductive Foams in Signal Return Path-Reference-Cited by-同舟云学术

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High-Frequency Behavior Analysis and Modeling of Degraded Conductive Foams in Signal Return Path

Published:2023-05 Issue:5 Volume:13 Page:666-674
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Wang Ziren¹^ORCID,Wang Shouyuan¹,Zang Jiawei¹^ORCID,Jin Qiuyan²^ORCID,Wu Yongle³^ORCID

Affiliation:

1. China Telecommunication Technology Laboratories, China Academy of Information and Communications Technology, Beijing, China

2. School of Information Science and Technology, Southwest Jiaotong University, Chengdu, China

3. School of Integrated Circuits, Beijing University of Posts and Telecommunications, Beijing, China

Funder

National Natural Science Foundation of China

open fund of Information Materials and Intelligent Sensing Laboratory of Anhui Province

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/10175659/10124731.pdf?arnumber=10124731

Reference22 articles.

1. Lens-Corrected Axis-Symmetrical Shaped Horn Antenna in Metallized Foam With Improved Bandwidth

2. Pressure-dependent variable resistors based on porous polymeric foams with conducting polymer thin films in situ coated on the interior surfaces

3. Breath sensor based on conductive foam: Idea, construction, and characterisation

4. Using Laminated Metal Foam as the Top-Side Contact of a PCB-Embedded Power Die

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Modeling and Analysis of Signal Integrity of High-Frequency Transmission Channel With Degraded Fuzz Button Connectors;IEEE Transactions on Electromagnetic Compatibility;2024

2. The Impact of Electrical Contact Degradation of Conductive Foam on Near-field Radiation;2023 IEEE 68th Holm Conference on Electrical Contacts (HOLM);2023-10-04

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