Noncontact Reflow Oven Thermal Profile Prediction Based on Artificial Neural Network-Reference-Cited by-同舟云学术

Noncontact Reflow Oven Thermal Profile Prediction Based on Artificial Neural Network

Published:2021-12 Issue:12 Volume:11 Page:2229-2237
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Li Yuanyuan^ORCID,He Jingxi^ORCID,Won Daehan^ORCID,Yoon Sang Won^ORCID

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/9645929/09570727.pdf?arnumber=9570727

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