Continuous Monitoring and Optimization of a Boilers Temperature with the Relay Circuit
Author:
Affiliation:
1. Kongu Engineering College,Department of Electrical and Electronics Engineering,Perundurai,India,638 060
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10330805/10331621/10331775.pdf?arnumber=10331775
Reference15 articles.
1. Thermocouple Condition Monitoring Using Thermocouple Resistance. Experimental Study
2. Low-Cost Non-Contact PCBs Temperature Monitoring and Control in a Hot Air Reflow Process Based on Multiple Thermocouples Data Fusion
3. Mechatronics Design and Kinematic Simulation of 5 DOF Serial Robot Manipulator for Soldering THT Electronic Components in Printed Circuit Boards
4. Noncontact Reflow Oven Thermal Profile Prediction Based on Artificial Neural Network
5. A Novel Cascade Temperature Control System for a High-Speed Heat-Airflow Wind Tunnel
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