Estimation of Heat Generation in Semiconductors Centrally Mounted on Printed Circuit Boards

Author:

Silveira Joao V. T.ORCID,Li Zidi,Fushinobu KazuyoshiORCID,Yasui Ryuta,Shinoda Takuya

Funder

Denso Corporation

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Reference20 articles.

1. Heat dissipation measurement of multiple electronic components on ECU by means of external heater and heat flux sensor;li;Proc IST,2019

2. Power Electronics Loss Measurement Using New Heat Flux Sensor Based on Thermoelectric Device With Active Control

3. Heat transfer correlations for free convection from upward-facing horizontal rectangular surfaces;corcione;WSEAS Trans Heat Mass Transf,2007

4. Factors affecting the calculation of effective conductivity in printed circuit boards [thermal analysis]

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Estimation of Heat Generation in Semiconductors by Inverse Heat Transfer Analysis;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-03

2. Tiny Power Box - Thermal Investigations for Very High Power Density Onboard Chargers;2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2022-09-28

3. Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint;Scientific Reports;2022-09-06

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