Investigation of Electrical and Thermal Properties of Epoxy Resin/Silicon Carbide Whisker Composites for Electronic Packaging Materials-Reference-Cited by-同舟云学术

Investigation of Electrical and Thermal Properties of Epoxy Resin/Silicon Carbide Whisker Composites for Electronic Packaging Materials

Published:2022-07 Issue:7 Volume:12 Page:1109-1121
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Chen Xiangrong¹^ORCID,Wang Qilong¹^ORCID,Huang Xiaofan¹^ORCID,Awais Muhammad¹^ORCID,Paramane Ashish²^ORCID,Ren Na¹^ORCID

Affiliation:

1. College of Electrical Engineering, Zhejiang University, Hangzhou, China

2. Electrical Engineering Department, National Institute of Technology, Silchar, Assam, India

Funder

Key Project of Natural Science Foundation of Zhejiang Province

National Natural Science Foundation of China

One-Hundred Talents Program of Zhejiang University

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

Reference31 articles.

5. Different nonlinear conduction mechanism between $\alpha$ -SiC and SS -SiC;enguang;Proc 6th IEEE Int Conf Properties Appl Dielectr Mater,2000

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