Funder
Defense Microelectronics Activity (DMEA), USA, through the Reliability Prediction Analysis for Solder Joint Integrity Program
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
5 articles.
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1. Effect of potting on the solder joint reliability of QFN packages under thermal cycling load;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. Effects of a Conformal Coating on the Signal Integrity of Space Electronics Systems;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-11
3. The Effect of Acrylic Conformal Coating in the Reliability of Solder Joints;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-04
4. Prediction of Solder Joint Reliability with Applied Acrylic Conformal Coating;Journal of Electronic Materials;2021-10-07
5. Reliability Impact of Assembly Materials for Micro-BGA Components in High Reliability Applications;2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC);2020-09-15