Ultrasonic-Assisted Micro-Silver Paste Sintering for Flip-Chip Bonding-Reference-Cited by-同舟云学术

Ultrasonic-Assisted Micro-Silver Paste Sintering for Flip-Chip Bonding

Published:2022-08 Issue:8 Volume:12 Page:1395-1400
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Lu Peiyuan¹,Wu Yongshuan¹,Wu Tianxiang¹^ORCID,Tian Wenya¹,Dou Long¹,Xiao Jinqing¹^ORCID,Li Junhui¹^ORCID

Affiliation:

1. State Key Laboratory of High Performance Complex Manufacturing and the School of Mechanical and Electronical Engineering, Central South University, Changsha, China

Funder

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/9868249/09844005.pdf?arnumber=9844005

Reference28 articles.

1. Low-temperature low-pressure die attach with hybrid silver particle paste

2. Mechanical property evaluation of nano‐silver paste sintered joint using lap‐shear test

3. Electric-current-assisted sintering of nanosilver paste for copper bonding

4. Low temperature sintering of Ag nanoparticles for flexible electronics packaging

5. Metal?metal bonding process using Ag metallo-organic nanoparticles

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