PCB tracks thermal simulation, analysis and comparison to IPC-2152 for electrical current carrying capacity-Reference-Cited by-同舟云学术

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PCB tracks thermal simulation, analysis and comparison to IPC-2152 for electrical current carrying capacity

Published:2010-09 Issue: Volume: Page:
ISSN:
Container-title:3rd Electronics System Integration Technology Conference ESTC
language:
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Author:

Bunea Radu,Codreanu Norocel-Dragos,Ionescu Ciprian,Svasta Paul,Vasile Alexandru

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5629474/5642799/05642897.pdf?arnumber=5642897

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Novel Gerber File-based Numerical Modeling and Simulation for Thermal Analysis of Printed Circuit Boards;2023 IEEE Applied Power Electronics Conference and Exposition (APEC);2023-03-19

2. Simulation and Experimental Investigation of Temperature-Current Rise in PCB with different electrical current and trace width;2022 International Conference on Cloud Computing, Big Data and Internet of Things (3CBIT);2022-10

3. Current Carrying Capacity of Inkjet-Printed Nano-Silver Interconnects on Mesoporous PET Substrate;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

4. Study on Techniques for the Increase of the Current Carrying Capability of the PCB Tracks;2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME);2021-10-27

5. Experimental Investigation of Temperature-Current Rise in Fine PCB Copper Traces on Polyimide, Aluminium and Ceramic (Al₂O₃) Substrates;Advanced Materials Research;2013-08

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