Author:
Schwarz Timo,Stahr Hannes,Cardoso Andre,Fernandes Elisabete,Lecavelier Des Etangs-Levallois Aurelien,Brizoux Michel
Cited by
3 articles.
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1. Thermal and Mechanical characterization of embedded PTCQ packaging test chip die;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
2. Experimental Characterization of Microvias Using TRL Calibration with Uncertainty Analysis;2022 Asia-Pacific Microwave Conference (APMC);2022-11-29
3. PCB Embedding Technology for 5G mmWave Applications;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13