Experimental Characterization of Microvias Using TRL Calibration with Uncertainty Analysis
Author:
Affiliation:
1. Institute of Microwave and Photonic Engineering, Graz University of Technology,Graz,Austria
2. AT &S Austria Technologie & Systemtechnik AG,Leoben,Austria
Funder
ECSEL Joint Un-dertaking (JU) project UltimateGaN
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9999720/9999721/09999955.pdf?arnumber=9999955
Reference10 articles.
1. Merging of packaging technologies for highly integrated embedded modules
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Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A Quasi-TEM Approach for Designing Microvias for PCB Layer Transition with Minimal Return Loss;2023 53rd European Microwave Conference (EuMC);2023-09-19
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