Author:
Hsieh Sheng-Chi,Kung Cheng-Yuan,Lee Teck Chong,Lin Hung-Yi,Lee Pao-Nan,Wang Chen-Chao
Cited by
2 articles.
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1. High Q-Factor 3D Tall Copper Pillar Inductor on a Wafer-Level Package for RF System Application;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25
2. Construction of LC Filter Integrated Circuit and Analysis of Control System Function;2023 IEEE 3rd International Conference on Power, Electronics and Computer Applications (ICPECA);2023-01-29