Packaging of a 15-kV Silicon Carbide MOSFET With Insulation Enhanced by a Nonlinear Resistive Polymer-Nanoparticle Coating
Author:
Affiliation:
1. Virginia Tech,CPES, the Bradley Department of Electrical and Computer Engineering,Blacksburg,US
2. College of Nanoscale Science and Engineering, State University of New York Polytechnic Institute,Albany,US
Funder
Advanced Research Projects Agency-Energy (ARPA-E)
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9947299/9947300/09947881.pdf?arnumber=9947881
Reference24 articles.
1. Protruding ceramic substrates for high voltage packaging of wide bandgap semiconductors
2. Stacked DBC Cavitied Substrate for a 15-kV Half-bridge Power Module
3. Stacking of Insulating Substrates and a Field Plate to Increase the PDIV for High Voltage Power Modules
4. Field Grading Composites Tailored by Electrophoresis—Part 3: Application to Power Electronics Modules Encapsulation
5. Enhancement of the partial discharge inception voltage of ceramic substrates for power modules by trench coating
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1. Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-05
2. Effective Field Grading at 200 °C of a Nonlinear Resistive Polymer Nanocomposite Coating for Medium-Voltage Power Modules;IEEE Transactions on Power Electronics;2024-04
3. Packaging of 15-kV Silicon Carbide Half-Bridge Module Enabled by a Nonlinear Resistive Polymer Nanocomposite Field-Grading Coating;2023 IEEE 10th Workshop on Wide Bandgap Power Devices & Applications (WiPDA);2023-12-04
4. Packaging of 20 kV Double-Side Cooled Silicon Carbide Diode Module With Electrical Insulation Enhanced by a Polymer-Nanoparticle Coating;2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe);2023-09-04
5. Package Design of a Double-Side Cooled 20-kV Gallium Nitride Diode Module With Improved Insulation by Nonlinear Resistive Polymer-Nanoparticle Coating;2023 IEEE Applied Power Electronics Conference and Exposition (APEC);2023-03-19
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