Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating-Reference-Cited by-同舟云学术

Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating

Published:2024-05 Issue:5 Volume:14 Page:776-783
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Zhang Zichen¹^ORCID,Arriola Emmanuel¹^ORCID,Nicholas Carl¹^ORCID,Lynch Justin²,Yun Nick²,Morgan Adam³^ORCID,Sung Woongje²,Ngo Khai D. T.¹^ORCID,Lu Guo-Quan⁴^ORCID

Affiliation:

1. Bradley Department of Electrical and Computer Engineering and Center for Power Electronics Systems (CPES), Virginia Tech, Blacksburg, VA, USA

2. Department of Nanoscale Science and Engineering, University at Albany, State University of New York, Albany, NY, USA

3. NoMIS Power, Albany, NY, USA

4. Department of Materials Science and Engineering and the Bradley Department of Electrical and Computer Engineering, Center for Power Electronics Systems (CPES), Virginia Tech, Blacksburg, VA, USA

Funder

Advanced Research Projects Agency-Energy of the Department of Energy

Virginia Innovation Partnership Corporation

U.S. Department of Energy

Center for Power Electronics Systems High Density Integration Industry Consortium at Virginia Polytechnic Institute and State University

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/5503870/10538069/10478103.pdf?arnumber=10478103

Reference39 articles.

1. Developing 13-kV 4H-SiC MOSFETs: Significance of Implant Straggle, Channel Design, and MOS Process on Static Performance

2. High-voltage SiC power modules for 10–25 kV applications;Passmore;Power Electron. Eur. Mag.,2016

3. Overview of high voltage sic power semiconductor devices: development and application

4. 15 kV SiC MOSFET: An Enabling Technology for Medium Voltage Solid State Transformers

5. Insulation Materials and Systems for Power Electronics Modules: A Review Identifying Challenges and Future Research Needs

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Review of Partial Discharge in Medium Voltage SiC Power Modules Under Square Wave Excitation: Characterization, Mitigation, and Detection;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-08

2. Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging—Power Die, Power Module, and Converter Level—Part 1;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-05