Design, Fabrication and Measurement of FOWLP-based Series-Fed Antennas for 6G D-Band MIMO Applications-Reference-Cited by-同舟云学术

Design, Fabrication and Measurement of FOWLP-based Series-Fed Antennas for 6G D-Band MIMO Applications

Published:2022-09-13 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
language:
Short-container-title:

Author:

Le Thi Huyen¹,Schwanitz Oliver¹,Ndip Ivan¹,Mueller Friedrich²,Braun Tanja³,Schneider-Ramelow Martin⁴

Affiliation:

1. RF & Smart Sensor Systems Fraunhofer Institute for Reliability and Microintegration,Berlin,Germany

2. System Integration & Interconnection Technologies Technical University Berlin,Berlin,Germany

3. System Integration & Interconnection Technologies Fraunhofer Institute for Reliability and Microintegration,Berlin,Germany

4. Acting Director of the Institute Technical University Berlin,Berlin,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9939139/9939378/09939481.pdf?arnumber=9939481

Reference17 articles.

1. 140 GHz CMOS on-chip dipole antenna with optimal ion-irradiated-silicon with vertical reflector;sato;2015 International Symposium on Antennas and Propagation (ISAP),2015

2. A micromachined double-dipole antenna for 122 – 140 GHz applications based on a SiGe BiCMOS technology

3. Fan-out wafer level packaging for 5G and mm-Wave applications

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Wideband Antennas on Thin-Film Packaging Substrates for 140 GHz 6G Applications;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Temperature dependent Dielectric Characterization of Low Loss Thin Film Polymer up to sub-THz bands;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. EM and system-level modelling of phased antenna arrays for D-band antenna-in-package and antenna-on-package implementation at 150 GHz;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

4. A Fully Integrated Wideband D-Band Receiver for 6G Applications;2023 31st Telecommunications Forum (TELFOR);2023-11-21

5. 3D Mold Embedded PCB-based MIMO Antenna Arrays for 79 GHz Automotive RADAR;2023 20th European Radar Conference (EuRAD);2023-09-20