Miniaturized Sensor Modules for under Water Applications realized by Printed Circuit Board Embedding Technology-Reference-Cited by-同舟云学术

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Miniaturized Sensor Modules for under Water Applications realized by Printed Circuit Board Embedding Technology

Published:2022-09-13 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
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Author:

Schutze David¹,Voitel Marcus²,Gottwald Stefan³,Spanier Malte¹,Becker Karl-Friedrich²,Ostmann Andreas²,Loher Thomas²,Hofmeister Andreas³,Schneider-Ramelow Martin¹

Affiliation:

1. TU Berlin,Berlin,Germany

2. Fraunhofer IZM,Berlin,Germany

3. Sensorik Bayern GmbH,Regensburg,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9939139/9939378/09939405.pdf?arnumber=9939405

Reference6 articles.

1. Chip embedding technology developments leading to the emergence of miniaturized system-in-packages

2. Experimental study of a hydro-Acoustic hybrid system for simultaneous underwater communication and positioning;kebkal;Proceedings of the International Offshore and Polar Engineering Conference,0

3. Realisation of highly miniaturised robust radio sensor nodes by component embedding in the printed circuit board;schutze;GMM-Fb 94 EBL 2020 - Elektronische Baugruppen und Leiterplatten Fellbach,2020

4. Development of Embedded Power Electronic Modules;bottcher;Proceedings of the IMAPS Nordic,2011

5. Bionics

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. PCB Embedding Technology for the Miniaturization of complex electronic systems;2022 IEEE CPMT Symposium Japan (ICSJ);2022-11-09

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