Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip-Reference-Cited by-同舟云学术

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Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Aoki Toyohiro¹,Sakuma Katsuyuki²,Mori Hiroyuki¹,Nakamura Koki¹,Hisada Takashi¹

Affiliation:

1. IBM Research – Tokyo,Kawasaki,Japan

2. IBM T.J. Watson Research Center,Yorktown Heights,NY,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195344.pdf?arnumber=10195344

Reference6 articles.

1. Modeling Spin Coating Over Topography and Uniformity Improvements Through Fill Patterns for Advanced Packaging Technologies

2. Modeling the topography of uneven substrates post spin-coating

3. Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps;sakuma;to be published in 2023 ECTC,0

4. Double-Exposure Grayscale Photolithography

5. IMS (Injection Molded Solder) Technology with Liquid Photoresist for Ultra Fine Pitch Bumping

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Local Thickness Control of Resist Mask Using Pad Density Dependence;Journal of The Japan Institute of Electronics Packaging;2024-08-01

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