Intermetallic Growth Study of Ultra-Thin Copper and Tin Bilayer for Hybrid Bonding Applications-Reference-Cited by-同舟云学术

Intermetallic Growth Study of Ultra-Thin Copper and Tin Bilayer for Hybrid Bonding Applications

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Khurana Gaurav¹,Panchenko Iuliana²

Affiliation:

1. Institute of Electronic Packaging Technology, Technische Universitaet Dresden,Dresden,Germany

2. Institute of Electronic Packaging Technology, Technische Universitaet Dresden All Silicon System Integration Dresden (ASSID), Fraunhofer Institute for Reliability and Microintegration IZM,Dresden,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195396.pdf?arnumber=10195396

Reference12 articles.

1. Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization

2. Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient;juang;Sci Rep,2018

3. Corrosion study on Cu/Sn-Ag solid-liquid interdiffusion microbumps by salt spray testing with 5 wt.% NaCl solution

4. Immersion plating

5. Low Thermal Budget Cu/SiO2 Hybrid Bonding Using Highly -oriented Nano-twinned Cu with Low Contact Resistivity and High Bonding Strength;ong;2022 17th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT) Taipei Taiwan,0

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