Finite Element Analysis of Shock & Vibration of a Printed Circuit Board Assembly Using the Beam Elements to Model the Solder Joints-Reference-Cited by-同舟云学术

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Finite Element Analysis of Shock & Vibration of a Printed Circuit Board Assembly Using the Beam Elements to Model the Solder Joints

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
language:
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Author:

Zheng Tieyu¹,Aminjikarai Babu²,Yang Ming-An³

Affiliation:

1. Microsoft Corporation,Redmond,WA,USA

2. ANSYS Incorporated,Canonsburg,PA,USA

3. Quanta Computer Corporation,Taipei,Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195587.pdf?arnumber=10195587

Reference12 articles.

1. Mechanical shock testing and modeling of PC motherboards

2. Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading

3. Drop testing and finite element simulation of stacked chip scale packages with and without underfill

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