Realization, multi-field coupled simulation and characterization of a thermo-mechanically robust LiDAR front end on a copper coated glass substrate-Reference-Cited by-同舟云学术

Realization, multi-field coupled simulation and characterization of a thermo-mechanically robust LiDAR front end on a copper coated glass substrate

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
language:
Short-container-title:

Author:

Kettelgerdes Marcel¹,Mezmer Peter²,Haeussler Michael J.³,Böttger Gunnar³,Tavakolibasti Majid²,Pandey Amit¹,Erdogan Hüseyin⁴,Elger Gordon⁵,Schacht Ralph⁶,Wunderle Bernhard²

Affiliation:

1. University of Applied Sciences,Ingolstadt,Germany

2. Chemnitz University of Technology,Germany

3. Fraunhofer Institute for Reliability and Microintegration (IZM),Germany

4. Conti Temic microelectronic GmbH,Germany

5. Fraunhofer Institute for Transportation and Infrastructure Systems (IVI),Germany

6. Brandenburg University of Technology,Cottbus-Senftenberg,Germany

Funder

BMBF

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195753.pdf?arnumber=10195753

Reference18 articles.

1. Linear Thermal Expansion Coefficient of Silicon from 293 to 1000 K

2. Thermo-mechanical-optical coupling within a digital twin development for automotive LiDAR

3. IPC-2141A - Controlled impedance circuit boards and high speed logic design;Institution for Interconnection and Packaging Electronic Circuits 3000 Lakeside Drive Bannockburn IL 60015 US Standard,2004

4. IEC-60825-1 - Safety of laser products;Institution for Interconnection and Packaging Electronic Circuits 3 rue de Varembé,2014

5. Structural-thermaloptical-performance (stop) analysis of a lens stack for realization of a digital twin of an automotive lidar;tavakolibasti;2022 23rd International Conference on Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),2022

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermo-mechanical reliability of glass substrate and Through Glass Vias (TGV): A comprehensive review;Microelectronics Reliability;2024-10