Development of PMUT Array Packaging from Characterisation Prototypes to Customer Samples-Reference-Cited by-同舟云学术

Development of PMUT Array Packaging from Characterisation Prototypes to Customer Samples

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Giusti Dominico¹,Gritti Alex¹,Quaglia Fabio¹,Savoia Alessandro Stuart²,Sandoh Hideyuki³,Klug Gerald³,Hoshino Hitoshi³,Rahul Dutta⁴,Rao Vempati Srinivasa⁴,Wee David Ho Soon⁴,Wakahara Masatoshi⁵,Shaw Mark¹

Affiliation:

1. STMicroelectronics Agrate,Brianza,Italy

2. Roma Tre University,Rome,Italy

3. Disco Hi-Tec Europe GmbH,Monaco,Germany

4. Institute of Microelectronics,Singapore

5. Disco Corporation,Tokyo,Italy

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195558.pdf?arnumber=10195558

Reference9 articles.

1. Back Cavity Formation on 50um Thick bumped PMUT wafers;giusti;EPTC 2022,0

2. Packaging and Modular Assembly of Large-Area and Fine-Pitch 2-D;lin;IEEE Trans Ultrason Ultrason Ferroelec freq Contr,2013

3. Co-packaging of PMUT array with FOWLP ASIC's

4. A feasibility study of a PMUT-based wearable sensor for the automatic monitoring of carotid artery parameters

5. Real-Time Control of the Resonance Frequency of a Piezoelectric Micromachined Ultrasonic Transducerfor Airborne Applications;passoni;2021 IEEE International Ultrasonics Symposium (IUS),0

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