Packaging of Ultra-dynamic Photonic Switches and Transceivers for Integration into 5G Radio Access Network and Datacenter Sub-systems-Reference-Cited by-同舟云学术

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Packaging of Ultra-dynamic Photonic Switches and Transceivers for Integration into 5G Radio Access Network and Datacenter Sub-systems

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Van Steenberge G.¹,Roelkens G.¹,Ossieur P.¹,Missinne J.¹,Van Asch J.¹,Zhang J.¹,Qin S.¹,Van Campenhout J.²,Van Kerkhof J.³,Milosevic M. M.³,Bakopoulos P.⁴,Syrivelis D.⁴,Mentovich E.⁵,Morozov K.⁶,Stracca S.⁷,Bigongiari A.⁷,Joerg T.⁸,Schlick D.⁸,Braun T.⁹,Wöhrmann M.⁹,Gernhardt R.⁹,Cheng Q.¹⁰,Li T.¹⁰,Penty R.¹⁰

Affiliation:

1. Imec and Ghent University,Gent,Belgium

2. Imec,Leuven,Belgium

3. PHIX Photonics Assembly,Enschede,The Netherlands

4. NVIDIA,Athens,Greece

5. NVIDIA,Yokneam,Israel

6. Innolume,Dortmund,Germany

7. Ericsson Research,Pisa,Italy

8. AT&S AG,Leoben,Austria

9. Fraunhofer Institute for Reliability and Microintegration,Berlin,Germany

10. Cambridge University,Cambridge,United Kingdom

Funder

European Union's Horizon Europe Research and Innovation Program

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195412.pdf?arnumber=10195412

Reference9 articles.

1. Push—pull microring-assisted space-and-wavelength selective switch

2. Integration of etched facet, electrically pumped, C-band Fabry-Pérot lasers on a silicon photonic integrated circuit by transfer printing

3. Transfer-printing-based integration of a III-V-on-silicon distributed feedback laser

4. $4\times25$ Gbps Polarization Diversity Silicon Photonics Receiver With Transfer Printed III-V Photodiodes

5. Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration

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1. Large-Scale and Multiband Silicon Photonics Wavelength Cross-Connect Switch With FSR-Free Grating-Assisted Contra-Directional Couplers;Journal of Lightwave Technology;2024-06-15

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