Study of Large Exposure Field Lithography for Advanced Chiplet Packaging-Reference-Cited by-同舟云学术

Study of Large Exposure Field Lithography for Advanced Chiplet Packaging

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
language:
Short-container-title:

Author:

Suda Hiromi¹,Shelton Douglas²,Takada Hiroki¹,Goto Yoshio¹,Urushihara Kosuke¹,Shinoda Ken-Ichiro¹

Affiliation:

1. Canon Inc.,Optical Producs Operations,Utsunomiya,Japan

2. Industrial Products Devision Canon U. S. A.,San Jose,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816627.pdf?arnumber=9816627

Reference7 articles.

1. A study of Sub-micron Fan-out Wafer Level Packaging solutions

2. Photolithography study for high-density integration technologies

3. Study of Submicron Patterning Exposure Tool for Fine 500mm Panel Size FOPLP;mori;2020 IEEE 70th Electronic Components and Technology Conference (ECTC),0

4. Sub-Micron RDL Patterning for Advanced Packaging

5. Study of Submicron Panel-Level Packaging in Mass-Production

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Study for realization of the next generation high density RDL packaging for 2.5D large silicon interposer.;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Study of submicron-resolution, high-accuracy overlay and large-field lithography for advanced packaging;Journal of Micro/Nanopatterning, Materials, and Metrology;2024-01-02

3. Chip Partition Heterogeneous Integration and Chip Split Heterogeneous Integration;Chiplet Design and Heterogeneous Integration Packaging;2023