Characterization and Analysis of Moisture absorption in Embedded System in Packaging
Author:
Affiliation:
1. Institute of Microelectronics of Chinese Academy of Sciences,System Packaging and Integration R&D Center,Beijing,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816377.pdf?arnumber=9816377
Reference15 articles.
1. Dual stage modeling of moisture absorption and desorption in epoxy mold compounds;xuejun;Microelectronics Reliability,2012
2. Effect of temperature and humidity on moisture diffusion in an epoxy moulding compound material
3. Selection and Characterization of Photosensitive Polyimide for Fan-out Wafer-Level Packaging;gao;IEEE Transactions on Components Packaging and Manufacturing Technology,2021
4. Hygrothermal Failures From Small Defects in Lead-Free Solder Reflowed Electronic Packages
5. In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging;ibrahim;Microelectronics Reliability,2018
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