In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging-Reference-Cited by-同舟云学术

In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging

Published:2018-05 Issue: Volume:84 Page:208-214
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Khalilullah Ibrahim,Reza Talukder,Chen Liangbiao,Placette Mark,Mazumder A.K.M. Monayem H.,Zhou Jiang,Fan Jiajie^ORCID,Qian Cheng,Zhang Guoqi,Fan Xuejun^ORCID

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference32 articles.

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4. Plastic-encapsulated Microelectronics;Pecht,1995

5. Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer;Yang;IEEE Trans. Compon. Packag. Technol.,2004

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