Development and Application of the Moisture-Dependent Viscoelastic Model of Polyimide in Hygro-Thermo-Mechanical Analysis of Fan-Out Interconnect
Author:
Affiliation:
1. National Cheng Kung University,Department of Mechanical Engineering,Tainan,Taiwan, R.O.C.
2. ASE Group Kaohsiung,Group R&D Center,Kaohsiung,Taiwan, R.O.C.
Funder
Ministry of Science and Technology
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816455.pdf?arnumber=9816455
Reference16 articles.
1. Time–Temperature and Time–Water Superposition Principles Applied to Poly(allylamine)/Poly(acrylic acid) Complexes
2. A time–temperature–moisture concentration superposition principle that describes the relaxation behavior of epoxide molding compounds for microelectronics packaging
3. Linear viscoelastic properties of HFPE-II-52 polyimide
4. Measurement of the Hygroscopic Swelling Coefficient of Thin Film Polymers Used in Semiconductor Packaging
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