A time–temperature–moisture concentration superposition principle that describes the relaxation behavior of epoxide molding compounds for microelectronics packaging-Reference-Cited by-同舟云学术

A time–temperature–moisture concentration superposition principle that describes the relaxation behavior of epoxide molding compounds for microelectronics packaging

Published:2020-07-17 Issue:6 Volume:25 Page:467-478
ISSN:1023-666X
Container-title:International Journal of Polymer Analysis and Characterization
language:en
Short-container-title:International Journal of Polymer Analysis and Characterization

Author:

Huber Fabian¹²^ORCID,Etschmaier Harald²^ORCID,Walter Hans³,Urstöger Georg⁴,Hadley Peter¹

Affiliation:

1. Institute of Solid State Physics, Graz University of Technology, Graz, Austria

2. ams AG, Premstaetten, Austria

3. Fraunhofer Institute for Reliability and Microintegration IZM, Berlin, Germany

4. Institute of Bioproducts and Paper Technology, Graz University of Technology, Graz, Austria

Publisher

Informa UK Limited

Subject

Polymers and Plastics,General Chemical Engineering,Analytical Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1080/1023666X.2020.1807680

Reference42 articles.

1. Fan, X. 2008. EuroSimE 2008. Presented at the International Conference on Thermal, Mechanical, Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, IEEE, Freiburg im Breisgau, Germany, pp. 1–14.

2. Investigation of Stress in MEMS Sensor Device Due to Hygroscopic and Viscoelastic Behavior of Molding Compound

3. Application of Humidity-Controlled Dynamic Mechanical Analysis (DMA-RH) to Moisture-Sensitive Edible Casein Films for Use in Food Packaging

4. Molecular interpretation of glass temperature depression by plasticizers

5. Moisture-induced plasticization of amorphous polyamides and their blends

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