New Packaging Technology for Disruptive 1- and 2- Dimensional VCSEL Arrays and Their Electro- Optical Performance and Applications

Author:

Dohle Rainer1,Henning Gerold2,Friedrich Thomas2,Wallrodt Maximilian2,Greus Christoph3,Neumeyr Christian3,Rosskopf Jurgen3,Hohenleitner Robert3

Affiliation:

1. Micro Systems Engineering GmbH,ENH-SMD,Berg,Germany,95180

2. Micro Systems Engineering GmbH,ENH-COB,Berg,Germany,95180

3. VERTILAS GmbH,Garching,Germany,85748

Publisher

IEEE

Reference26 articles.

1. Wire Bonding Advances for Multi-Chip and System in Package Devices

2. Prüfverfahren für Drahtbondverbindungen,2017

3. Long-wavelength InP-based VCSELs with buried tunnel junction: properties and applications

4. DSP-free and real-time transmission of 50Gb/s NRZ over 15km SSMF and 64Gb/s NRZ B2B with a 1.3?m VCSEL;verplaetse;Optical Fiber Communication Conf Exposition (OFC),2018

5. Optical Transmitter Based on a 1.3-μm VCSEL and a SiGe Driver Circuit for Short-Reach Applications and Beyond

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