The Effect of Thermal Stress on the Reliability of all-Printed Vias on Flexible Substrates-Reference-Cited by-同舟云学术

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The Effect of Thermal Stress on the Reliability of all-Printed Vias on Flexible Substrates

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Somarathna Udara S.¹,Alhendi Mohammed¹,Garakani Behnam¹,Poliks Mark D.¹,Weerawarne Darshana L.²,Iannotti Joseph³,Kapusta Christopher J.³,Stoffel Nancy³,Gonya Stephen G.⁴

Affiliation:

1. The State University of New York,Center for Advanced Microelectronics Manufacturing,Binghamton,USA

2. University of Colombo,Department of Physics,Colombo 03,Sri Lanka

3. GE Global Research,Niskayuna,New York,USA

4. Lockheed Martin,Owego,New York,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816703.pdf?arnumber=9816703

Reference20 articles.

1. Transparent Conductive Printable Meshes Based on Percolation Patterns

2. Fabrication and non-destructive characterization of through-plastic-via (TPV) in flexible hybrid electronics

3. Screen Printed Vias for a Flexible Energy Harvesting and Storage Module

4. Reliable filling of through vias with silver based conductive adhesives in flexible PEN substrates using low-cost optimized stencil printing methods;peter;2013 Eurpoean Microelectronics Packaging Conference (EMPC) EMPC,2013

5. Nano-silver inkjet printed interconnections through the microvias for flexible electronics

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