Dry etch processing in fan-out panel-level packaging - An application for high-density vertical interconnects and beyond-Reference-Cited by-同舟云学术

Dry etch processing in fan-out panel-level packaging - An application for high-density vertical interconnects and beyond

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Schein Friedrich-Leonhard¹,Voigt Christian¹,Gerhold Lutz¹,Tsigaras Ioannis²,Elghazzali Mohamed²,Sawamoto Hirofumi²,Strolz Ewald²,Rettenmeier Roland²,Kahle Ruben³,Bottcher Lars³

Affiliation:

1. Technische Universität Berlin,Faculty IV – Electrical Engineering and Computer Science,Berlin,Germany

2. Business Unit Advanced Packaging Evatec AG,Trübbach,Switzerland

3. System Integration & Interconnection Technologies Fraunhofer IZM,Berlin,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816568.pdf?arnumber=9816568

Reference13 articles.

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3. Fluorine-based plasmas: Main features and application in micro-and nanotechnology and in surface treatment

4. Capacitively coupled glow discharges at frequencies above 13.56 MHz

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