Anisotropy of curing residual stress of underfill in the encapsulation under three-dimensionally constrained condition based on in-situ characterization-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Anisotropy of curing residual stress of underfill in the encapsulation under three-dimensionally constrained condition based on in-situ characterization

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
language:
Short-container-title:

Author:

Peng Tao¹,Peng Xiaohui¹,Wu Wenjie¹,Peng Liang¹,Li Gang¹,Yang Jinbao¹,Yang Yuanyuan¹,Chen Jing¹,Zhu CaiPing¹,Zhu Pengli¹,Sun Rong¹

Affiliation:

1. Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology,Shenzhen,China,518055

Funder

Innovation Fund

Chinese Academy of Sciences

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816434.pdf?arnumber=9816434

Reference11 articles.

1. Warpage Modeling and Characterization of the Cure-dependent Chemical Shrinkage and Viscoelastic Relaxation for Cured Molding Process

2. An Integrated Warpage Prediction Model Based on Chemical Shrinkage and Viscoelasticity for Molded Underfill

3. In-situ measurement of chemical shrinkage of MY750 epoxy resin by a novel gravimetric method

4. Digital image correlation measurement of resin chemical and thermal shrinkage after gelation

5. Evaluation of in-situ shrinkage and expansion properties of polymer composite materials for adhesive anchor systems by a novel approach based on digital image correlation

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP