Warpage Modeling and Characterization of the Cure-dependent Chemical Shrinkage and Viscoelastic Relaxation for Cured Molding Process-Reference-Cited by-同舟云学术

Warpage Modeling and Characterization of the Cure-dependent Chemical Shrinkage and Viscoelastic Relaxation for Cured Molding Process

Published:2018-10 Issue: Volume: Page:
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Container-title:2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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Author:

Yeh Shu-Shen,Lin Po-Yao,Lee Kuang-Chun,Wang Jin-Hua,Lin Wen-Yi,Yew Ming-Chih,Lai Po-Chen,Hsu Chia-Kuei,Yang Che-Chia,Liao Li-Ling,Lin Yu-Sheng,Jeng Shin-Puu

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8614716/8625712/08625838.pdf?arnumber=8625838

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