Investigation Of Stress Generated By Interconnection Processes With Micro-Raman Spectroscopy (μRS)
Author:
Affiliation:
1. Technische Hochschule Ingolstadt,Institute of Innovative Mobility (IIMo),Ingolstadt,Germany,85049
2. Fraunhofer Institute for Transportation and Infrastructure Systems IVI,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816447.pdf?arnumber=9816447
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2. Raman spectroscopy to investigate gallium nitride light emitting diodes after assembling onto copper substrates
3. Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics
4. Thermomechanical stress in GaN‐LEDs soldered onto Cu substrates studied using finite element method and Raman spectroscopy
5. Thermomechanical Stress in GaN LED Soldered on Copper Substrate Evaluated by Raman Measurements and Computer Modelling
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