Thermomechanical stress in GaN‐LEDs soldered onto Cu substrates studied using finite element method and Raman spectroscopy-Reference-Cited by-同舟云学术

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Thermomechanical stress in GaN‐LEDs soldered onto Cu substrates studied using finite element method and Raman spectroscopy

Published:2020-07-27 Issue:10 Volume:51 Page:2083-2094
ISSN:0377-0486
Container-title:Journal of Raman Spectroscopy
language:en
Short-container-title:J Raman Spectrosc

Author:

Liu E.¹^ORCID,Conti Fosca²^ORCID,Bhogaraju Sri Krishna¹^ORCID,Signorini Raffaella²^ORCID,Pedron Danilo²,Wunderle Bernhard³,Elger Gordon¹^ORCID

Affiliation:

1. Institute of Innovative Mobility Technische Hochschule Ingolstadt Ingolstadt Germany

2. Department of Chemical Sciences University of Padova Padova Italy

3. Faculty of Electrical Engineering and Information Technology Chemnitz University of Technology Chemnitz Germany

Funder

German Federal Ministry of Education and Research

Publisher

Wiley

Subject

Spectroscopy,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/jrs.5947

Reference53 articles.

1. Integrating MEMS and ICs

2. Defect analysis using scanning acoustic microscopy for bonded microelectronic components with extended resolution and defect sensitivity

3. Vibration Analysis Based Modeling and Defect Recognition for Flip-Chip Solder-Joint Inspection

4. Nondestructive diagnosis of flip chips based on vibration analysis using PCA-RBF

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1. Raman Investigation on Silicon Nitride Chips after Soldering onto Copper Substrates;Micromachines;2024-07-31

2. Micro-Raman for Local Strain Evaluation of GaN LEDs and Si Chips Assembled on Cu Substrates;Micromachines;2023-12-22

3. Fabrication of High-Performance Insulated Metal Substrates Employing h-BN Mixture/Epoxy Composite Coated on Roughened Copper Plate;Materials Science;2023-11-08

4. Time domain diffuse Raman spectroscopy using single pixel detection;Biomedical Optics Express;2023-10-13

5. Study of stress/strain and structural defects at Cu/GaN interface;Vacuum;2023-07

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