Laser soldered wire bonding on liquid printed and sputtered contact structures on thin-flexes and injection molded devices-Reference-Cited by-同舟云学术

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Laser soldered wire bonding on liquid printed and sputtered contact structures on thin-flexes and injection molded devices

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Fettke Matthias¹,Kubsch Timo¹,Fisch Anne¹,Baa Mohammed Ziad¹,Teutsch Thorsten¹,Seifert Tobias²,Baum Mario²,Selbmann Franz²,Paul Soumya Deep³,Roscher Frank²,Kreyssig Kerstin²,Wiemer Maik²,Kuhn Harald²

Affiliation:

1. PacTech GmbH,Nauen,Germany,14641

2. Fraunhofer Institute for Electronic Nano Systems ENAS,Chemnitz,Germany,09126

3. Technische Universität,Center for Microtechnologies,Chemnitz,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816698.pdf?arnumber=9816698

Reference12 articles.

1. An ultra-thin and highly flexible multilayer Printed Circuit Board based on Parylene

2. Product data sheet Teonex Q51,0

3. Assessment of Fluxless Solid Liquid Interdiffusion Bonding by Compressive Force of Au-PbSn and Au-SAC for Flip Chip Packaging

4. JEDEC Solid State Technology Association;JESD22-B117B,2014

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