Demonstration of Fan-out Silicon Photonics Module for Next Generation Co-Packaged Optics (CPO) Application-Reference-Cited by-同舟云学术

Demonstration of Fan-out Silicon Photonics Module for Next Generation Co-Packaged Optics (CPO) Application

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Chou Bruce¹,Sawyer Brett M.¹,Lyu Gap¹,Timurdugan Erman¹,Minkenberg Cyriel¹,Zilkie Aaron J.¹,McCann David¹

Affiliation:

1. Rockley Photonics, Inc,Pasadena,California,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816401.pdf?arnumber=9816401

Reference16 articles.

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3. 1.6Tbps Silicon Photonics Integrated Circuit for Co-Packaged Optical-IO Switch Applications

4. A Large-Scale Heterogeneous Photonics Integration Platform for Next-Generation Communication Products;li;Asia Communications and Photonics Conference (ACP),2021

5. Measurement and Analysis of a High-Speed TSV Channel

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