Investigation of LowK WLCSP Die Strength Impact induced by Singulation Process
Author:
Affiliation:
1. Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu, Taiwan,R.O.C.,300-77
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816500.pdf?arnumber=9816500
Reference4 articles.
1. Investigation of 3-pass laser grooving process development for low-k devices
2. Die singulation technologies for advanced packaging: A critical review
3. LowK wafer dicing robustness considerations and laser grooving process selection
4. Introduction of Laser Pi-Grooving as Breakthrough Solution to Enhance die Strength of 40 nm ulow-k CMOS Silicon Technology during Wafer Saw Process
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