Low Temperature Fine-pitch Cu-Cu Bonding Using Au Nanoparticles as Intermediate
Author:
Affiliation:
1. Tsinghua University,School of Integrated Circuits,Beijing,China
2. Semiconductor Technology Innovation Center (Beijing) Corporation,Beijing,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816591.pdf?arnumber=9816591
Reference25 articles.
1. Low-Temperature (260 °C) Solderless Cu–Cu Bonding for Fine-Pitch 3-D Packaging and Heterogeneous Integration
2. Low-Temperature (70°C) Cu-to-Cu Direct Bonding by Capping Metal Layers
3. Low Temperature Copper-Copper Bonding of Non-Planarized Copper Pillar With Passivation
4. Interface and Reliability Analysis of Au-Passivated Cu–Cu Fine-Pitch Thermocompression Bonding for 3-D IC Applications
5. Cooperative Bilayer of Lattice-Disordered Nanoparticles as Room-Temperature Sinterable Nanoarchitecture for Device Integrations
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