Mechanical Property Evolution in SAC+Bi Lead-Free Solders Subjected to Various Thermal Exposure Profiles-Reference-Cited by-同舟云学术

Mechanical Property Evolution in SAC+Bi Lead-Free Solders Subjected to Various Thermal Exposure Profiles

Published:2022-05 Issue: Volume: Page:
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Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Al Ahsan Mohammad¹,Hasan S M Kamrul¹,Haq Mohammad Ashraful¹,Suhling Jeffrey C.¹,Lall Pradeep¹

Affiliation:

1. Auburn University,Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3),Auburn,AL,36849

Publisher

IEEE

Link

Reference20 articles.

1. Aging and creep behavior of Sn3.9Ag0.6Cu solder alloy;xiao;Proc 54th Electronics Components Technology Conf,2004

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2. Mechanical Characterization and Modeling of iSAC Lead-Free Solder;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. The Effects of Thermal Exposure on the Creep Behavior of SAC+Bi Lead-Free Solders;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

4. Evolution of the Creep Response of SAC305 Solder Due to Mechanical Cycling;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30