Applied Modeling Framework in Integrated Circuit Design and Reliability
Author:
Affiliation:
1. Advanced Packaging & Modeling IBM Systems,Bromont,Canada
2. Viasat, Inc,Semiconductor Packaging Engineer Manager
3. Viasat, Inc,RF / Microwaye
4. Business Development Manager IBM Systems,Bromont,Canada
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816404.pdf?arnumber=9816404
Reference19 articles.
1. Thermo-mechanical modeling of a 3D flip chip fully populated BGA package
2. Effect of finite element modeling techniques on solder joint fatigue life prediction of flip-chip BGA packages;fan;56th Electronic Components and Technology Conference 2006,2006
3. Issues in fatigue life prediction model for underfilled flip chip bump
4. Integrated Modeling of C4 Interconnects
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