Author:
Chai Chee Meng,Stoeckl Stephan,Pape Heinz,Foo Mun Yee ,Tan Ai Min
Cited by
2 articles.
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1. Applied Modeling Framework in Integrated Circuit Design and Reliability;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
2. Modeling of Effect of Underfill Properties on Flip Chip Bumps and Solder Balls of FCBGA Package in Automotive Underhood Applications;2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2021-06-01