Bonding Properties of Cu Paste in Low Temperature Pressureless Processes
Author:
Affiliation:
1. Mitsui Mining & Smelting Co., Ltd,Business Creation Sector,Saitama,Japan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816373.pdf?arnumber=9816373
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3. The bonding properties of various surface finishes with Cu paste for pressure sintering
4. Evaluation of die attach materials for high temperature power electronics appictions and analysis of the Ag particles sintering solution;alberto;Doctoral thesis,2015
5. Low-temperature low-pressure die attach with hybrid silver particle paste
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