Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics
Cited by
39 articles.
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1. A Novel Deep Reinforcement Learning Methodology for EMI Mitigation in Multiscenario Pinmap Design;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-07
2. Modeling Power-Bus Structures with Physics-Informed Neural Networks;2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa);2024-05-20
3. Analytical Approaches for Effects of Edge-Located EBG Structure With Defected Ground Structure on Cavity-Mode Resonances of Power/Ground Planes;IEEE Transactions on Microwave Theory and Techniques;2022-12
4. Electromagnetic Analysis in PINMAP Assignment Optimization Based on T-matrix Method;2022 IEEE 22nd International Conference on Communication Technology (ICCT);2022-11-11
5. Fast Calculation and Optimization of Dense Signal/Ground Vias in System-in-Package;2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC);2022-09-01